Chemical Name:Bis-(sodium sulfopropyl) -disulfide
Molecular formula: C6H12Na2O6S
Molecular weight: 354.4
CAS NO. 27206-35-5
1) Product Features:
Products that not contain inorganic sulfide and sulfite, copper sulfate does not increase turbidity, scientific analysis, product quality and stability.
2) Quality Standards: Q/LZ 30-2008
Appearance: Colorless or yellowish Powder
Assay: min 85% (HLPC)
Concentration in the bath: 20-100mg/L
Solubility: 38% water solution(Slightly soluble in alcohol)
3) Application
SPS for acid copper plating, decorative and functional availability coating (such as: printed circuit board). SPS can be a typical copper formulations, such as non-ionic surfactant, polyamine and other thiol compounds in combination, can also be used in conjunction with the dye, if combined with DPS and EXP2887 with, you will get better results.
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關鍵字： Bis-(sodium sulfopropyl) -disulfide，SPS,copper plating intermidate
Hubei Lingzhi Chemical Science & Technology Co.,Ltd, in partnership with Wuhan Institute of Technology, is a high-tech and national technology-innovation support enterprise, specializing in electroplating intermediates. We have twenty years experience in electroplating intermediates area. To make sure our products are accurate and with good stability, we keep strict quality control from raw materials purchasing to manufacturing process.